Connected Vehicle

Collaboration between STMicroelectronics and Virscient

STMicroelectronics has joined forces with Virscient, a provider of hardware and software development services. Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP).

According to the company, MTP is a comprehensive development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor. It enables the rapid prototyping and development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles.

Virscient claims to have a deep understanding of wireless connectivity technologies and protocols ideal for architecting connected-car systems that rely on technologies such as GNSS (Precise Positioning), LTE/cellular modems, V2X technologies, Wi Fi, Bluetooth, and Bluetooth Low Energy.

The Telemaco3P incorporates dual Arm® Cortex®-A7 processors with an embedded Hardware Security Module (HSM), an independent Arm Cortex-M3 subsystem, and set of connectivity interfaces. With security at its core, and considerable flexibility in both hardware and software configurations, the Telemaco3P provides platform for connectivity within the vehicular environment.

Source: Press Release


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