Micron Technology is working with Qualcomm Technologies to enable an automotive connectivity solution that leverages 5G networks for autonomous driving and direct cellular vehicle-to-everything (C-V2X) communication.
According to the company, the new Qualcomm Snapdragon automotive 5G Platform will feature a custom Micron 149 ball count multichip package that would allow for speeds of up to 20 times faster than current LTE-Advanced modems, hence widening the possibilities for vehicles to connect to other vehicles, roadside infrastructure and beyond.
Micron created a portfolio of ultra-small 8×9.5mm, 149 ball count multichip package (MCP) solutions with SLC NAND plus LPDDR4 rated at automotive temperature grade to pair with the Snapdragon Automotive 5G Platform. The Snapdragon Automotive 5G Platform with integrated C-V2X direct communication technology is designed to provide the low latency, high data speed, and reliable cellular connection coverage required for next-generation connected cars and autonomous driving.
Source: Press Release