Connected Vehicle

Qualcomm launches world’s first commercial 20 nm LTE advanced chipset for automotive

United States: Qualcomm Incorporated has announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., has added the Qualcomm Gobi 9×30 platform with extended lifecycle support to Snapdragon Automotive Solutions, enabling advanced telematics and infotainment features for next-generation systems.
Based on Qualcomm Technologies’ fourth-generation LTE platform, the Gobi 9×30 supports LTE Advanced Category 6 with up to 300 Mbps downlink data rates, enabling broadband vehicle connectivity for enhanced navigation, Wi-Fi hotspot, infotainment content and telematics services.

The Gobi 9×30 is the world’s first commercially announced cellular modem for automotive based on the 20 nm technology node with support for global carrier aggregation deployments up to 40 MHz in both LTE FDD and TDD modes. Gobi 9×30 builds upon Qualcomm Technologies’ leading LTE modem technology for automotive, the Gobi 9×15, and promises to enable fast 3G and 4G LTE connections worldwide, a superior next-generation Global Navigation Satellite System (GNSS) engine, while supporting broad multi-region coverage in a single SKU with the Qualcomm RF360 Front End Solution. The Gobi 9×30 features broad multimode capability with support for all other major cellular technologies, including LTE TDD networks in China.

In addition to 3G/LTE connectivity, the new platform is pre-integrated with QCA6574, a dual-stream 802.11ac Wi-Fi and Bluetooth 4.1 chipset designed to simultaneously support in-car Wi-Fi hotspot functions and Bluetooth profiles. The QCA6574 also supports DSRC (dedicated short-range communications), a technology required to comply with future regulation recently announced by the National Highway Traffic Safety Administration (NHTSA) to increase safety through vehicle-to-vehicle (V2V) communication. The Gobi 9×30 and QCA6574 will also be pre-integrated with Qualcomm Technologies’ recently-announced automotive-grade Snapdragon 602A processor.

Kanwalinder Singh, Senior Vice President of Business Development for Qualcomm Technologies, Inc., said:”The need for high-speed connectivity in the automobile is driving ever-increasing data rates as well as greater integration of features and technologies, adding Gobi 9×30 to our technology leading LTE lineup offers to our module, Tier-1 and automaker customers the flexibility of a global SKU with next-generation LTE features including data rates up to 300 Mbps and carrier aggregation. The Gobi 9×30 sets a new bar for features and integration: 20 nm technology node; support for both LTE FDD and TDD modes; built-in next-generation GNSS engine; pre-integration with Snapdragon 602A; and pre-integration with QCA 6574, supporting 802.11ac, BT 4.1, and DSRC.”
Source: http://www.qualcomm.com/media/releases/2014/02/24/qualcomm-announces-worlds-first-commercial-20-nm-lte-advanced-chipset

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