Connected VehicleContent and MultimediaInfotainment

Toshiba adds high quality multimedia and in-cab camera support to its automotive chips

Published: October 23, 2014 | Santa Clara, CA

Toshiba America Electronics Components (TAEC)  launched a key new addition to its extensive portfolio of solutions for the automotive market. The TC358791XBG automotive companion chip was created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car.

The new chip supports the latest automotive Gigabit Ethernet AVB standard for a wide range of applications, such as front/rear/surround-view cameras, digital audio and transferring high-resolution video content to head-unit and rear-seat entertainment systems. The TC358791XBG can also seamlessly interface with and support many leading-edge automotive application processors on the market, thanks to its USB 3.0. 

It can split one video input into two pictures and can simultaneously drive two high-resolution low-voltage differential signaling (LVDS) digital displays. Examples include head units, instrument clusters, and parking aid vision systems. The chipset can also send high-resolution audio and video data from the host processor to multiple displays or other electronic control units in the car, and it has a High Definition Multimedia Interface (HDMI®) 1.4 receiver interface to allow connection of HDMI-enabled devices to the application processor.

The new chip is housed in a FBGA257 15mm x 15mm package with 0.8 mm ball pitch. Additional features include differential CVBS (composite) interfaces for analog composite video sources, support for early back-up camera view (CVBS to LVDS), and ability to relay packetized IQ audio tuner data to the host via USB.

Availability: Samples of the TC358791XBG automotive infotainment chipset are available now. Volume production is slated to begin in March 2015.

Source: Toshiba

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