CEVA has announced the availability of its CEVA-SLAM™ software development kit. The Kit is aimed at streamlining the development of Simultaneous Localization and Mapping (SLAM) enabled products, including mobile devices, AR/VR headsets, robots, autonomous vehicles and other camera-based devices.
SLAM is the underlying technology that enables high-accuracy 3D mapping of a device’s surroundings. It is a key component for a broad range of emerging devices including AR/VR headsets, drones, robots and other autonomous machines.
CEVA is a known licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. The company partners with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT.
CEVA-SLAM incorporates the hardware, software and interfaces required to significantly lower the entry barrier for companies looking to integrate efficient SLAM implementations into low-power embedded systems. It will be available for the CEVA-XM family of intelligent vision DSPs and the NeuPro family of AI processors,
Source: Press Release