Trends such as the proliferation of camera, display, radar, lidar and other sensors are creating growing demand for high-performance wired interfaces in vehicles. Keeping this in view the MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, while drawing on its existing specifications for mobile devices is developing and enhancing automotive specifications.
Recently it announced key advancements and activities designed to enhance advanced driver assistance systems (ADAS), autonomous driving systems (ADS) and other automotive applications to meet the stringent requirements of automotive OEMs, Tier 1 suppliers, SoC designers and other industry providers in areas such as reliability, functional safety and low electromagnetic interference (EMI).
In a white paper published, “MIPI Alliance: Driving the Wires of Automotive,” MIPI laid out how it is leveraging its current specifications for automotive applications and developing enhancements and new specifications for this sector.
The white paper includes an in-depth look at the upcoming MIPI A-PHY specification and its key technical advantages. Development work is well underway on the MIPI A-PHY v1.0 physical layer specification, which will provide the automotive industry with a unified in-vehicle connectivity standard that meets the industry’s need for high speed, low latency, functional safety, lightweight wiring, low power consumption and the desired economies of scale.
MIPI A-PHY v1.0 specification work is expected to be completed by the end of 2019, with the specification available in early 2020. Meanwhile, MIPI is now identifying requirements for A-PHY v2.0, and OEMs, Tier 1 suppliers and others in the automotive ecosystem are invited to join MIPI to contribute to this important work. It’s anticipated that the first vehicles using A-PHY components will be in production in 2024.
The Alliance is also updating other specifications to meet the requirements of increasingly advanced vehicles and to help system designers, developers and manufacturers bring new technologies and features to market more quickly and at lower costs.
Source: Press Release