Ansys receives 2021 TSMC OIP Partner of the Year Awards for next-generation design enablement
Home/Ansys receives 2021 TSMC OIP Partner of the Year Awards for next-generation design enablement/Thermal-analysis-of-a-2-5D-package-by-Ansys–RedHawk-SC-Electrothermal–showing-the-temperature-dist Thermal-analysis-of-a-2-5D-package-by-Ansys–RedHawk-SC-Electrothermal–showing-the-temperature-dist Ansys receives 2021 TSMC OIP Partner of the Year Awards for next-generation design enablement