New Product Launches and Partnerships to Improve Device Capabilities With 5G Chipsets

The development of new 5G chipsets is ongoing to power the next-generation of devices including smartphones. The revolution in the smartphone industry will be driven with the help of 5G chipsets. So, technology firms are focusing their efforts and conducting extensive R&D activities on the development of chipsets with best-in-class capabilities. These chipsets are developed for improving the capabilities of smartphones in terms of speed, efficiency, and power. These chipsets will power the devices and improve the overall user experience. As the era of internet of things (IoT) arrive, the demand for 5G chipsets is increasing and manufacturers are taking efforts in developing chips that will power such devices. New products are launched to support next generation of smartphones and improve communication network capabilities. In addition, partnership is another strategy adopted by manufacturers to enhance capabilities of their devices and appeal users to opt for their products. The demand for 5G chipsets will increase considerably in the coming years. According to the report published by Allied Market Research, the global 5G chipset market is estimated to reach $92.05 billion by 2030. Following are some of the activities taking place across the world. 

Market players are adopting various strategies such as new product launches to raise their stakes in the competitive marketplace and widen the portfolio of solutions. MediaTek launched the Dimensity 1050 system-on-chip [SoC] solution, which is a mmWave 5G chipset that will supply the power to the upcoming 5G smartphones. The chipset is developed with an aim to ensure seamless power efficiency, improve gaming experience, provide smooth connectivity, and enhance display. In addition, the dual connectivity of mmWave and sub-6GHz will provide the next generation smartphones with the required capacity and speed. 

CH Chen, the Deputy General Manager of Wireless Communications Business Unit at MediaTek, highlighted that the new chipset will offer features that will help smartphones gain competitive edge in the market. With superior power efficiency, uninterrupted connectivity, and end-to-end 5G experience, smartphones will have reliable and superfast connectivity and advanced technologies in cameras. MediaTek’s HyperEngine 5.0 gaming technology incorporated in the Dimensity 1050 will expand the game time and overall performance for smartphones. Also, the LPDDR5 memory and high-end UFS 3.1 storage will speed up the data streaming, apps, and social feeds. The launch of such innovative chipsets will bring a new dimension for smartphones. 

The trend of launch of new solutions continues with another tech giant launching their solutions to accelerate the new generation of devices. Samsung introduced new chipsets for 5G solutions and devices. These new line products include baseband units, Compact Macro, and Massive MIMO units. These chipsets have the third-generation mmWave Radio Frequency Integrated Circuit (RFIC) chip, the Digital Front End (DFE)-RFIC integrated chip, and the second-generation 5G modem System-on-Chip (SoC).

Commenting on the new chipsets, Junehee Lee, the Executive Vice President and Head of R&D, Networks Business at Samsung Electronics, highlighted that the chipsets are the fundamental parts of the 5G solutions. They are developed through the extensive R&D activities and aimed at taking the company to the forefront of 5G technology development. The RFIC chip will improve power consumption and support 28 GHz and 39 GHz spectrums to result in lightweight and compact-sized 5G radio devices. The DFE-RFIC Integrated Chip will two-fold the frequency of bandwidth, surge output power, and lower down the size. The 2nd Generation 5G Modem SoC chip will support mmWave and below-6 GHz spectrums. In addition, it will surge the power efficiency of 5G Massive MIMO and Compact Macro radio. The devices will improve power and speed of Samsung’s next generation of smartphones. 

Along with the strategy of launching new chipsets, market players adopted the strategy of partnership to take advantage of each other’s capabilities to strengthen products. Ligado Networks partnered with Sony Semiconductor Israel for development of 5G chipsets for Ligado’s mobile satellite network. This step is taken to power internet of things (IoT) devices and deploy connectivity services in the North American region. The 5G satellite IoT network will provide support for millions of mobile devices and enable machine-to-machine communication. New IoT solutions will be deployed in various sectors such as agriculture, energy, transportation, utilities, and others. 

Sachin Chhibber, the Chief Technology Officer at Ligado, highlighted that the partnership is aimed at advancing new capabilities and providing solutions for the 5G mobile satellite connectivity market in the North American region, especially in the U.S. The newly-developed chipsets will offer support to the 5G mobile private network solutions through reliability and coverage. This will help companies in modernizing their operations and improve the communication with customers. Sony highlighted that it will take comprehensive design efforts and develop standards for its chipsets to assist in development of 5G IoT technology and provide compatibility with Ligado’s L-band MSS spectrum. The partnership strategy to utilize 5G chipsets to improve overall capabilities of network will assist the market growth in the coming years.    

Author:

Pratik Kirve is writer, blogger, and sport enthusiast. He holds a bachelor degree in Electronics and Telecommunication Engineering, and is currently working as a Team Lead – Content Writing at Allied Market Research. He has an avid interest in writing across different verticals. When he is not following the updates and trends, he spends his time reading, writing poetry, and playing football.

Published in Telematics Wire