NXP and Cohda unveils connected car technology with its new V2X device

NXP Semiconductors
NXP Semiconductors

Netherlands: Cohda Wireless and NXP Semiconductors have launched the MK4 which is the latest generation of its connected car anti-collision technology based on the NXP/Cohda RoadLINK chipset. The chipset addresses both Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) implementations, collectively referred to as V2X.

The MK4 is half the size of its predecessor and provides OEMs with a flexible, scalable solution while significantly reducing BOM costs, in line with customer requirements. Compared with competitor solutions, the Cohda/NXP RoadLINK chipset exchanges messages reliably across an extended range at high speed, cutting ‘time to react’ and communicating potential hazards and safety-critical scenarios significantly faster than conventional applications. Supporting both DSRC (IEEE 802.11p) and Wi-Fi (802.11abgn) wireless standards, the RoadLINK chipset can upload and access data via home wi-fi and hotspot connections.

It also comes with an open and extensible Software Development Kit (SDK) that allows customers to configure and evolve Cohda applications to meet their own specific requirements.

Cohda Wireless, CEO, Paul Gray said: ‘’ The MK4 continued Cohda’s leadership in the connected vehicle space. Cohda devices are clearly the most successful V2X devices in the world today, with 50 per cent of vehicles in V2X trials globally containing Cohda equipment, we are leading in this technology. For example, 1500 vehicles in the world’s largest V2V trial, the 2800-vehicle Safety Pilot trial at Ann Arbor, Michigan, contain Cohda equipment.”

Gray continued: “The MK4 extends our well-established leadership. It is smaller, cheaper and more powerful than previous versions and, as with previous generations of Cohda products, will deliver the best outdoor performance. Cohda already licenses its technology to Tier One automobile manufacturers from the US, Europe, Japan and Korea. The MK4 positions us strongly to deliver automotive-qualified solutions for 2015.”

Torsten Lehmann, Senior Vice President and General Manager car entertainment solutions, NXP Semiconductors, said: “The RoadLINK chipset is setting new performance, system cost and footprint benchmarks for the connected vehicle, combining NXP’s market proven multi-standard software-defined radio technology with Cohda’s superior V2X and mobile communication algorithms, together with Cohda Wireless we are providing our customers with best-in-class, flexible solutions for quick mass adoption of V2X communication. Our technology will help to avoid traffic accidents, save lives and reduce CO2 emissions.”





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