Connected Vehicle

Lear, IMS Connector Systems partner on high speed Ethernet solutions

Lear Corporation announced that it has signed a joint development agreement with IMS Connector Systems GmbH, a technology company based in Löffingen, Germany, specializing in high-speed Ethernet solutions for automotive applications.

Ethernet provides a cost-effective, scalable solution for higher data transmission speed and capacity in increasingly connected vehicles. It can run alongside or bypass standard cabling, allowing all vehicle components to connect with lighter and more functional wires – reducing connectivity costs and cabling weight while providing significantly higher bandwidth and better performance.

Ethernet is key as vehicles are transmitting more data due to the increasing use of sensors, actuators and other control devices to support advanced driver assist systems and in-vehicle comfort and convenience features. Ethernet may also be a critical enabler of future technologies, including highly autonomous or fully autonomous operating systems and edge computing, which moves computation and data storage from the cloud into the location where it is needed to improve response times.

“Lear and IMS Connector Systems are sharing extensive experience in connector design and advanced manufacturing to improve high-speed data transmission,” said Carl Esposito, Lear Senior Vice President and President, E-Systems. “These new connectors enable new applications made possible by the growing capabilities of network architectures in next-generation vehicles.”

Lear and IMS Connector Systems expect availability of a fully validated product beginning in 2023.

“IMS Connector Systems is proud to work with Lear on high-speed automotive Ethernet solutions that will optimize and improve existing products andenable new mobility features,” said Peter Peetz, IMS Connector Systems CEO. “With vehicle architectures becoming more complex and connected, we expect that high-speed Ethernet applications will experience a significantly higher market penetration in the future.”

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