ADASDigital Cockpit

LG selects Valens’s chipsets for next-gen camera system

  • LG Electronics Vehicle component Solutions(VS) Company to integrate Valens Semiconductor’s VA7000 in its active safety next-generation camera system project. It is the part of its Digital Cockpit Electronics Solutions to enable Advanced Driver Assistance Systems (ADAS) for Automotive OEMs
  • Automotive OEMs are expected to be able to benefit from this inaugural solution starting 2026
  • Key benefits of the VA7000 chipset family include Superior Electromagnetic Compatibility (EMC) performance and Reduced Total System Cost (TSC)
  • Solidifies MIPI A-PHY’s position as the leading connectivity standard of choice to enable a variety of ADAS applications

HOD HASHARON, Israel, Aug. 10, 2023 /PRNewswire/. — Valens Semiconductor announced that LG Vehicle component Solutions (VS) Company has selected Valens Semiconductor’s VA7000 MIPI A-PHY chipset family for its next generation camera system project. As a result, automotive OEMs are expected to be able to benefit from this inaugural solution starting 2026.

Valens Semiconductor chipsets will serve as the foundational connectivity solution for multiple camera sensors. In addition. these chipsets will integrate with the LG VS Company’s advanced next-generation camera system. Consequently, this will enable the seamless display of multifunctional information to augment driver decision-making and enhance passenger safety.

“Valens Semiconductor’s partnership with the LG VS Company is clear testament to our shared vision, thus providing unmatched high-performance solutions for the automotive industry,” said Gideon Kedem, SVP and Head of Automotive at Valens Semiconductor. “Today’s announcement demonstrates the execution of Valens Semiconductor’s strategy to develop disruptive and standardized high-performance connectivity solutions. It is a key milestone towards mass production of our VA7000 MIPI A-PHY compliant chipsets. Furthermore, it will enable high-performance ADAS connectivity solutions in a multi-billion addressable market.”

“After examining alternative connectivity solutions on the market, we chose to partner with Valens Semiconductor. We will deploy their VA7000 MIPI A-PHY chipsets in the LG VS Company’s upcoming camera system for our Digital Cockpit Electronics. Both companies have pre-validated the VA7000 feature set and excellent EMC capabilities, and they are collaborating for mass production application,” said Juneun Park, VP of the Head Unit Development at LG VS Company. “At LG Electronics, our continuous focus is on enhancing mobility capabilities with a strong emphasis on safety and security. This ensures that we offer our customers highly reliable solutions. We expect this groundbreaking offering to be ready for mass production for Automotive OEMs in 2026. Also, we are looking forward to further expand our collaboration towards broad adoption of the MIPI A-PHY standard.”

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