OmniVision Technologies, today announced the OVM9284 CameraCubeChip™ module. It is an automotive-grade, wafer-level camera. This 1 megapixel (MP) module has a compact size of 6.5 x 6.5mm. It has the low power consumption. The image sensor has a 3 micron pixel and a 1/4″ optical format and 1280 x 800 resolution. It is built on OmniPixel®3-GS global-shutter pixel architecture.
“Most existing DMS cameras use glass lenses, which are large and difficult to hide from drivers to avoid distraction, and are too expensive for most car models,” said Aaron Chiang, marketing director at OmniVision. “Our OVM9284 CameraCubeChip module is the world’s first to provide automotive designers with the small size, low power consumption and reflowable form factor of wafer-level optics.”
The OVM9284’s integration of OmniVision’s image sensor, signal processor and wafer-level optics in a single compact package reduces the complexity of dealing with multiple vendors, and increases supply reliability while speeding development time. Furthermore, unlike traditional cameras, all CameraCubeChip modules are reflowable. This means they can be mounted to a printed circuit board simultaneously with other components using automated surface-mount assembly equipment, which increases quality while reducing assembly costs.
OVM9284 module samples are available now, and mass production is expected in Q4 of 2020.